Paper Title:
The Relationship between Thermal Conductivity and Microstructure in Si3N4 Ceramics
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 161-163)
Edited by
K. Niihara, T. Sekino, E. Yasuda, T. Sasa
Pages
213-216
DOI
10.4028/www.scientific.net/KEM.161-163.213
Citation
K. Watari, K. Ishizaki, S. Cao, K. Mori, "The Relationship between Thermal Conductivity and Microstructure in Si3N4 Ceramics", Key Engineering Materials, Vols. 161-163, pp. 213-216, 1999
Online since
July 1998
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Price
$32.00
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