Paper Title:
Thermal Residual Micro-Stress Concentration and Strength of SiC-Alumina Nanocomposites
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 161-163)
Edited by
K. Niihara, T. Sekino, E. Yasuda, T. Sasa
Pages
397-400
DOI
10.4028/www.scientific.net/KEM.161-163.397
Citation
S. Kovalev, T. Ohji, Y. Yamauchi, M. Sakai, "Thermal Residual Micro-Stress Concentration and Strength of SiC-Alumina Nanocomposites", Key Engineering Materials, Vols. 161-163, pp. 397-400, 1999
Online since
July 1998
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.