Paper Title:
Profiled Ceramic Micropackages for Microwave Application
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 161-163)
Edited by
K. Niihara, T. Sekino, E. Yasuda, T. Sasa
Pages
687-0
DOI
10.4028/www.scientific.net/KEM.161-163.687
Citation
C. Anton, M. Muntean, A. Muller, V. Burghelea, D. Radu, S. Iordanescu, "Profiled Ceramic Micropackages for Microwave Application", Key Engineering Materials, Vols. 161-163, pp. 687-0, 1999
Online since
July 1998
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Price
$32.00
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