Paper Title:
Creep Behavior and Modeling of SiC-Based PC Ceramic Matrix Composites with Glass Sealant in High Temperature Air
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 164-165)
Edited by
K. Niihara, K. Nakano, T. Sekino, E. Yasuda
Pages
197-200
DOI
10.4028/www.scientific.net/KEM.164-165.197
Citation
T. Ishikawa, N. Suzuki, I. J. Davies, M. Shibuya, T. Hirokawa, J. Gotoh, "Creep Behavior and Modeling of SiC-Based PC Ceramic Matrix Composites with Glass Sealant in High Temperature Air", Key Engineering Materials, Vols. 164-165, pp. 197-200, 1999
Online since
July 1998
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.