Paper Title:
Creep at the Mesoscopic and Microscopic Scale of 2.5D Cf-SiC
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 164-165)
Edited by
K. Niihara, K. Nakano, T. Sekino, E. Yasuda
Pages
313-316
DOI
10.4028/www.scientific.net/KEM.164-165.313
Citation
G. Boitier, J. Vicens, J.-L. Chermant, "Creep at the Mesoscopic and Microscopic Scale of 2.5D Cf-SiC", Key Engineering Materials, Vols. 164-165, pp. 313-316, 1999
Online since
July 1998
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.