Paper Title:
Creep Behaviour at High Temperatures of Fine SiC and Alumina Based Fibres
  Abstract

  Info
Periodical
Edited by
E. Yasuda, F. Wakai, L.M. Manocha, Y. Tanabe
Pages
57-64
DOI
10.4028/www.scientific.net/KEM.166.57
Citation
M. H. Berger, A.R. Bunsell, "Creep Behaviour at High Temperatures of Fine SiC and Alumina Based Fibres", Key Engineering Materials, Vol. 166, pp. 57-64, 1999
Online since
April 1999
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Price
$35.00
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