High-Temperature Deformation of Cu-SiO2 Bicrystals with [011] Twist Boundaries |
| Journal |
Key Engineering Materials (Volumes 171 - 174) |
| Volume |
Creep and Fracture of Engineering Materials and Structures |
| Edited by |
T. Sakuma, K. Yagi |
| Pages |
269-276 |
| DOI |
10.4028/www.scientific.net/KEM.171-174.269 |
| Citation |
Hiromi Miura et al., 1999, Key Engineering Materials, 171-174, 269 |
| Authors |
Hiromi Miura, K. Saijo, Taku Sakai |
| Keywords |
Cu-SiO2 Bicrystal, Grain Boundary Energy, Grain Boundary Fracture, Grain Boundary Sliding, High Temperature Deformation |
| Full Paper |
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