Paper Title:
Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 171-174)
Edited by
T. Sakuma, K. Yagi
Pages
633-638
DOI
10.4028/www.scientific.net/KEM.171-174.633
Citation
Q. Zhou, G. Itoh, "Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits", Key Engineering Materials, Vols. 171-174, pp. 633-638, 2000
Online since
October 1999
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Price
$32.00
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