Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits |
| Journal |
Key Engineering Materials (Volumes 171 - 174) |
| Volume |
Creep and Fracture of Engineering Materials and Structures |
| Edited by |
T. Sakuma, K. Yagi |
| Pages |
633-638 |
| DOI |
10.4028/www.scientific.net/KEM.171-174.633 |
| Citation |
Qing Zhou et al., 1999, Key Engineering Materials, 171-174, 633 |
| Authors |
Qing Zhou, Goroh Itoh |
| Keywords |
Al-1%Si-0.5%Cu Alloy, Grain Size, Microelectronic Circuit, Subgrains, Texture, Thickness, Thin Foil |
| Full Paper |
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