Paper Title:
Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 171-174)
Edited by
T. Sakuma, K. Yagi
Pages
655-662
DOI
10.4028/www.scientific.net/KEM.171-174.655
Citation
M.D. Mathew, S. Movva, K.L. Murty, "Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys", Key Engineering Materials, Vols. 171-174, pp. 655-662, 2000
Online since
October 1999
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Price
$32.00
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