Paper Title:

Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders

Periodical Key Engineering Materials (Volumes 171 - 174)
Main Theme Creep and Fracture of Engineering Materials and Structures
Edited by T. Sakuma, K. Yagi
Pages 663-668
DOI 10.4028/www.scientific.net/KEM.171-174.663
Citation Noboru Wade et al., 1999, Key Engineering Materials, 171-174, 663
Authors Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara
Keywords Creep, Micro-Alloyed, Microstructure, Particle Dispersion Strengthening, Rupture Strength, Sn-Pb Eutectic Alloy, Solder, Strength
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