Paper Title:
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 171-174)
Edited by
T. Sakuma, K. Yagi
Pages
663-668
DOI
10.4028/www.scientific.net/KEM.171-174.663
Citation
N. Wade, T. Akuzawa, J. Kunii, K. Miyahara, "Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders", Key Engineering Materials, Vols. 171-174, pp. 663-668, 2000
Online since
October 1999
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Price
$32.00
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