Paper Title:
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
| Periodical |
Key Engineering Materials (Volumes 171 - 174)
|
| Main Theme |
Creep and Fracture of Engineering Materials and Structures
|
| Edited by |
T. Sakuma, K. Yagi |
| Pages |
663-668 |
| DOI |
10.4028/www.scientific.net/KEM.171-174.663 |
| Citation |
Noboru Wade et al., 1999, Key Engineering Materials, 171-174, 663 |
| Authors |
Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara |
| Keywords |
Creep, Micro-Alloyed, Microstructure, Particle Dispersion Strengthening, Rupture Strength, Sn-Pb Eutectic Alloy, Solder, Strength |
| Price |
US$ 28,- |