Paper Title:
Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range
  Abstract

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Periodical
Key Engineering Materials (Volumes 171-174)
Edited by
T. Sakuma, K. Yagi
Pages
817-824
DOI
10.4028/www.scientific.net/KEM.171-174.817
Citation
S. Testu, J.L. Besson, T. Rouxel, G.B. Granger, "Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range", Key Engineering Materials, Vols. 171-174, pp. 817-824, 2000
Online since
October 1999
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