Paper Title:
Microstructure and Friction Properties of Cluster Diamond Dispersed Cu Composite
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 177-180)
Edited by
T.X. Yu, Q.P. Sun and J.K. Kim
Pages
793-798
DOI
10.4028/www.scientific.net/KEM.177-180.793
Citation
K. Hanada, A. Imahori, H. Negishi, T. Sano, M. Mayuzumi, "Microstructure and Friction Properties of Cluster Diamond Dispersed Cu Composite", Key Engineering Materials, Vols. 177-180, pp. 793-798, 2000
Online since
April 2000
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Price
$32.00
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