A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer |
| Journal |
Key Engineering Materials (Volumes 183 - 187) |
| Volume |
Fracture and Strength of Solids IV |
| Edited by |
W. Hwang and K.S. Han |
| Pages |
1123-1128 |
| DOI |
10.4028/www.scientific.net/KEM.183-187.1123 |
| Citation |
Ji Ho Lim et al., 2000, Key Engineering Materials, 183-187, 1123 |
| Authors |
Ji Ho Lim, Ji Soon Kim, Kyoung Wook Paik, Y.Y. Earmme |
| Keywords |
CBA, Lamination, Laser Profilometry, MCM-D, Multi-Layer, Stoney's Formula, Stress Relaxation, Thermomechanical Bow |
| Full Paper |
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