Paper Title:
A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 183-187)
Edited by
W. Hwang and K.S. Han
Pages
1123-1128
DOI
10.4028/www.scientific.net/KEM.183-187.1123
Citation
J. H. Lim, J. S. Kim, K. W. Paik, Y.Y. Earmme, "A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer", Key Engineering Materials, Vols. 183-187, pp. 1123-1128, 2000
Online since
April 2000
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Price
$32.00
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