Paper Title:
Strength and Fracture of Cu-Based Filamentary Nanocomposites
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 183-187)
Edited by
W. Hwang and K.S. Han
Pages
1207-1212
DOI
10.4028/www.scientific.net/KEM.183-187.1207
Citation
S. I. Hong, J.H. Chung, H. S. Kim, "Strength and Fracture of Cu-Based Filamentary Nanocomposites", Key Engineering Materials, Vols. 183-187, pp. 1207-1212, 2000
Online since
April 2000
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Price
$32.00
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