Buckling and Fracture of Thin Films under Compression |
|
| Journal | Key Engineering Materials (Volumes 183 - 187) |
|---|---|
| Volume | Fracture and Strength of Solids IV |
| Edited by | W. Hwang and K.S. Han |
| Pages | 187-192 |
| DOI | 10.4028/www.scientific.net/KEM.183-187.187 |
| Citation | B. Cotterell et al., 2000, Key Engineering Materials, 183-187, 187 |
| Authors | B. Cotterell, Z. Chen |
| Keywords | Buckling, Compliant Substrate, Crack, Delamination, Thin Film |
| Full Paper | 
Get the full paper by clicking here
|
First page example
