Paper Title:
Numerical Analysis of Dimple Fracture Process under Different Constraint Conditions
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 183-187)
Edited by
W. Hwang and K.S. Han
Pages
875-880
DOI
10.4028/www.scientific.net/KEM.183-187.875
Citation
M. Kikuchi, A. Takahashi, "Numerical Analysis of Dimple Fracture Process under Different Constraint Conditions", Key Engineering Materials, Vols. 183-187, pp. 875-880, 2000
Online since
April 2000
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Price
$32.00
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