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Precision Machining of Advanced Materials

Key Engineering Materials Volume 196

• Papers
• Abstracts

• p1 Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor   [ 873 K ]
  Authors: Hong Ho Cheng, H.Y. Tsai, Yue Long Huang
• p25 A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process   [ 391 K ]
  Authors: Junji Watanabe, R. Etoh, M. Hirano
• p31 Some Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics Method   [ 498 K ]
  Authors: Wun Chet Davy Cheong, Liang Chi Zhang, Hiroaki Tanaka
• p43 Assessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by Drilling   [ 411 K ]
  Authors: Hou Jiang Zhang, Wu Yi Chen, Ding Chang Chen, Liang Chi Zhang
• p53 Grinding of Ceramics: Strength, Surface Features and Grinding Conditions   [ 409 K ]
  Authors: Tian Shu Liu, Bruno A. Latella, Liang Chi Zhang
• p61 Grinding Burn Mechanism of Directionally Solidified Superalloy   [ 362 K ]
  Authors: Ming Chen, Fang Hong Sun, Bing Yuan Xue
• p69 Wear Mechanism of Diamond Cutting Tool in Machining of Steel   [ 588 K ]
  Authors: Hiroaki Tanaka, Shoich Shimada, Naoya Ikawa, M. Yoshinaga
• p79 A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis   [ 556 K ]
  Authors: K. Maekawa, Akihiko Kubo, T.H.C. Childs
• p91 Improvement of Friction and Wear Properties of CVD-SiC Films with New Surface Finishing Method 'ELID-Grinding'   [ 640 K ]
  Authors: T. Kato, Hitoshi Ohmori, C. Zhang, T. Yamazaki, Y. Akune, K. Hokkirigawa
• p103 A New Device of Abrasive Jet Machining and Application to Abrasive Jet Printer   [ 439 K ]
  Authors: Tsunemoto Kuriyagawa, Takashi Sakuyama, Katsuo Syoji, Hiromitsu Onodera
• p111 On-Machine Monitoring of the Wheel-Working Surface Condition with the Relative Frequency Distribution of its Profile   [ 461 K ]
  Authors: Shinji Shimizu, Haruhisa Sakamoto
• p121 On-Machine Monitoring of the Wheel Working Surface Condition with the Fractal Dimension Analysis of Its Profile   [ 556 K ]
  Authors: Haruhisa Sakamoto, Shinji Shimizu
• p133 Fabrication of Metal-Bonded Grinding/Polishing Tools by Greentape Laser Sintering Method   [ 432 K ]
  Authors: K. Maekawa, Y. Yokoyama, I. Ohshima
• p141 Abrasive Capacity of Thin Film Diamond Structures   [ 517 K ]
  Authors: Jenny Andersson, P. Hollman, S. Jacobson
• p149 Micro Hole Machining of Borosilicate Glass through Electrochemical Discharge Machining (ECDM)   [ 698 K ]
  Authors: C.T. Yang, S.S. Ho, Bo Huei Yan