Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor |
| Journal |
Key Engineering Materials (Volume 196) |
| Volume |
Precision Machining of Advanced Materials |
| Edited by |
L. Zhang |
| Pages |
1-24 |
| DOI |
10.4028/www.scientific.net/KEM.196.1 |
| Citation |
Hong Ho Cheng et al., 2001, Key Engineering Materials, 196, 1 |
| Authors |
Hong Ho Cheng, H.Y. Tsai, Yue Long Huang |
| Keywords |
CMP, Endpoint, Kinematics, Material Removal, Monitoring, Non-Uniformity, Planarization, Polishing, Semiconductor |
| Full Paper |
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