Paper Title:

Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor

Periodical Key Engineering Materials (Volume 196)
Main Theme Precision Machining of Advanced Materials
Edited by L. Zhang
Pages 1-24
DOI 10.4028/www.scientific.net/KEM.196.1
Citation Hong Ho Cheng et al., 2001, Key Engineering Materials, 196, 1
Authors Hong Ho Cheng, H.Y. Tsai, Yue Long Huang
Keywords CMP, Endpoint, Kinematics, Material Removal, Monitoring, Non-Uniformity, Planarization, Polishing, Semiconductor
Price US$ 28,-
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