A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process |
| Journal |
Key Engineering Materials (Volume 196) |
| Volume |
Precision Machining of Advanced Materials |
| Edited by |
L. Zhang |
| Pages |
25-30 |
| DOI |
10.4028/www.scientific.net/KEM.196.25 |
| Citation |
Junji Watanabe et al., 2001, Key Engineering Materials, 196, 25 |
| Authors |
Junji Watanabe, R. Etoh, M. Hirano |
| Keywords |
Activation Energy, Chemical Mechanical Polishing (CMP), Planarization Polishing, Strained Layer, Thin Surface Grinding |
| Full Paper |
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