Paper Title:
A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process
  Abstract

  Info
Periodical
Edited by
L. Zhang
Pages
25-30
DOI
10.4028/www.scientific.net/KEM.196.25
Citation
J. Watanabe, R. Etoh, M. Hirano, "A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process", Key Engineering Materials, Vol. 196, pp. 25-30, 2001
Online since
January 2001
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Price
$32.00
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