Paper Title:
Influence of AlN Intergranular Phases on Wetting and Bonding between Copper and Aluminum Nitride
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 206-213)
Main Theme
Edited by
C. Kermel, V. Lardot, D. Libert and I. Urbain
Pages
555-558
DOI
10.4028/www.scientific.net/KEM.206-213.555
Citation
T. Joyeux, J. Jarrige, J.C. Labbe, J.P. Lecompte, "Influence of AlN Intergranular Phases on Wetting and Bonding between Copper and Aluminum Nitride", Key Engineering Materials, Vols. 206-213, pp. 555-558, 2002
Online since
December 2001
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.