Paper Title:
Wettability of SiC/Liquid Cu with Ti Additive System
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 224-226)
Edited by
Jianghong Gong and Wei Pan
Pages
749-754
DOI
10.4028/www.scientific.net/KEM.224-226.749
Citation
S. J. Li, X. M. Zang, H. P. Duan, "Wettability of SiC/Liquid Cu with Ti Additive System", Key Engineering Materials, Vols. 224-226, pp. 749-754, 2002
Online since
June 2002
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.