Paper Title:
The Thermal Transient Stress Maximum during Quenching of Ceramics: A Comparison of Experimental Data with Numerical Simulation
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 224-226)
Edited by
Jianghong Gong and Wei Pan
Pages
807-812
DOI
10.4028/www.scientific.net/KEM.224-226.807
Citation
F. Osterstock, F. Tancret, J.-M. Gatt, "The Thermal Transient Stress Maximum during Quenching of Ceramics: A Comparison of Experimental Data with Numerical Simulation", Key Engineering Materials, Vols. 224-226, pp. 807-812, 2002
Online since
June 2002
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Price
$32.00
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