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Modeling of Materials

Key Engineering Materials Volume 227

• Papers
• Abstracts

• p1 Simulation of Polymer Removal from a Powder Injection Molding Compact by Thermal Debinding   [ 319 K ]
  Authors: Shengjie Ying, Yee Cheong Lam, S.C.M. Yu, K.C. Tam
• p7 Singularity of Interface Stresses in Fibre Push-Out Test   [ 444 K ]
  Authors: Joo Hyuk Park, Ying Dai, Jang Kyo Kim
• p17 A Self-Consistent Scheme for Asperity Contact   [ 248 K ]
  Authors: H. Fan, K.Y. Sze
• p23 Microstructural Influences on Inhomogeneous Deformation in Superplastic Ti-6Al-4V   [ 342 K ]
  Authors: Tae Won Kim, Nak Sam Choi
• p31 Novel Methods to Measure Residual Stresses in Thin Films   [ 542 K ]
  Authors: Tong Yi Zhang
• p41 The Root Angle in Elastoplastic Peeling Tests   [ 297 K ]
  Authors: Z. Chen
• p49 Fracture Toughening Analysis of Shape Memory Alloys   [ 230 K ]
  Authors: Shan Gao, Sung Yi
• p55 Finite Element Modelling Damage in Brittle Matrix Composites   [ 277 K ]
  Authors: J. Chia, J.W. Hancock
• p61 Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages   [ 273 K ]
  Authors: C.W. Chong, T.F. Guo, Lin Cheng
• p67 Three-Dimensional Modeling of Coordination Number and Contiguity in the Incipient Stage of Liquid Phase Sintering   [ 247 K ]
  Authors: Po-Liang Liu, Shun Tian Lin
• p73 Micromechanical Modeling of Granular Materials Using Three Dimensional Discrete Element Modeling   [ 267 K ]
  Authors: T.G. Sitharam, S.V. Dinesh
• p79 A Constitutive Equation for Viscoelastic Porous Gels during Drying Process   [ 359 K ]
  Authors: Biao Wang, Yulan Liu, Zhongmin Xiao
• p87 A Thermodynamic Model of the BCC ⇢ FCC Polymorphic Change in Niobium due to Nanocrystallization by Mechanical Milling   [ 272 K ]
  Authors: P.P. Chattopadhyay, I. Manna
• p93 The Modeling and Determination of Dynamic Elastic Modulus of Metal Matrix Composites   [ 360 K ]
  Authors: Narasimalu Srikanth, Manoj Gupta
• p101 Micro-Macro Combined Study for a Porous Constitutive Model Based on the Analysis of a Cylindrical Void   [ 365 K ]
  Authors: Bin Chen, Zhan Hua Gao, Xiang He Peng, Jing Hong Fan, C. Cai