Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages |
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| Journal | Key Engineering Materials (Volume 227) |
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| Volume | Modeling of Materials |
| Edited by | C.-h. Chiu, Z. Chen, H. Gao, K.Y. Lam, A.A.O. Tay |
| Pages | 61-66 |
| DOI | 10.4028/www.scientific.net/KEM.227.61 |
| Authors | C.W. Chong, T.F. Guo, Lin Cheng |
| Keywords | Finite Element Analysis (FEA), IC Packages, Multiaxial Straining, Popcorn Failure, Unstable Void Growth |
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