Paper Title:
Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages
  Abstract

  Info
Periodical
Edited by
C.-h. Chiu, Z. Chen, H. Gao, K.Y. Lam, A.A.O. Tay
Pages
61-66
DOI
10.4028/www.scientific.net/KEM.227.61
Citation
C.W. Chong, T.F. Guo, L. Cheng, "Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages", Key Engineering Materials, Vol. 227, pp. 61-66, 2002
Online since
August 2002
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Price
$32.00
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