Popcorn Failure and Unstable Void Growth in Plastic Electronic Packages |
| Journal |
Key Engineering Materials (Volume 227) |
| Volume |
Modeling of Materials |
| Edited by |
C.-h. Chiu, Z. Chen, H. Gao, K.Y. Lam, A.A.O. Tay |
| Pages |
61-66 |
| DOI |
10.4028/www.scientific.net/KEM.227.61 |
| Citation |
C.W. Chong et al., 2002, Key Engineering Materials, 227, 61 |
| Authors |
C.W. Chong, T.F. Guo, Lin Cheng |
| Keywords |
Finite Element Analysis (FEA), IC Package, Multiaxial Straining, Popcorn Failure, Unstable Void Growth |
| Full Paper |
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