Paper Title:
Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
  Abstract

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Periodical
Key Engineering Materials (Volumes 230-232)
Edited by
Teresa Vieira
Pages
513-516
DOI
10.4028/www.scientific.net/KEM.230-232.513
Citation
C. Louro, F. Teixeira Dias, L. F. Menezes, A. Cavaleiro, "Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films", Key Engineering Materials, Vols. 230-232, pp. 513-516, 2002
Online since
October 2002
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