Paper Title:
New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices
  Abstract

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Periodical
Key Engineering Materials (Volumes 230-232)
Edited by
Teresa Vieira
Pages
92-95
DOI
10.4028/www.scientific.net/KEM.230-232.92
Citation
H. Seiroco, M. Vincente, J. Ferreira, F. M. Braz Fernandes, A.P. Marvão, J.I. Martins, E. Fortunato, R. Martins, "New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices", Key Engineering Materials, Vols. 230-232, pp. 92-95, 2002
Online since
October 2002
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