Paper Title:
Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 233-236)
Edited by
L.C. Zhang and G. Lu
Pages
779-784
DOI
10.4028/www.scientific.net/KEM.233-236.779
Citation
K. Sasaki, A. Yanagimoto, H. Ishikawa, "Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations", Key Engineering Materials, Vols. 233-236, pp. 779-784, 2003
Online since
January 2003
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Price
$32.00
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