Paper Title:
Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results
  Abstract

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Periodical
Key Engineering Materials (Volumes 238-239)
Edited by
Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima
Pages
229-234
DOI
10.4028/www.scientific.net/KEM.238-239.229
Citation
H. J. Kim, H. Y. Kim, H. D. Jeong, S. H. Lee, D. Dornfeld, "Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results", Key Engineering Materials, Vols. 238-239, pp. 229-234, 2003
Online since
April 2003
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$32.00
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