Paper Title:
Material Removal Mechanism in Dynamic Friction Polishing of Diamond
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 238-239)
Edited by
Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima
Pages
235-240
DOI
10.4028/www.scientific.net/KEM.238-239.235
Citation
K. Suzuki, M. Iwai, T. Uematsu, N. Yasunaga, "Material Removal Mechanism in Dynamic Friction Polishing of Diamond", Key Engineering Materials, Vols. 238-239, pp. 235-240, 2003
Online since
April 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Cheng Yong Wang, C. Chen, Yue Xian Song
Abstract:In order to achieve the smooth surface of diamond, several kinds of mixture oxidizing agents have been used to polish the single crystal...
852
Authors: Yuan Liang Zhang, Zhi Min Zhou, Zhi Hui Xia
Abstract:Ultrasonic vibration is applied to diamond turning of special stainless steel to decrease diamond tool wear and improve the surface quality...
57
Authors: Ekkard Brinksmeier, Ralf Gläbe
Abstract:As is well known, excessive chemical tool wear occurs when steel alloys are machined with monocrystalline diamond tools prevents many...
701
Authors: Yi Qing Chen, Thai Nguyen, Liang Chi Zhang
Abstract:This investigation aims to develop a quantitative model to estimate the material removal of polycrystalline diamond composites by dynamic...
436
Authors: Li Zhou, Shu Tao Huang, L.F. Xu
I. Advanced Manufacturing Technology and Equipment
Abstract:A new setup for polishing of diamond films on a high speed rotating stainless plate has been developed, and a rare earth metal plate was used...
137