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An Analysis of the Pad Deformation for Improved Planarization

Journal Key Engineering Materials (Volumes 238 - 239)
Volume Advances in Abrasive Technology V
Edited by Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima
Pages 241-246
DOI 10.4028/www.scientific.net/KEM.238-239.241
Citation Thin-Lin Horng, 2003, Key Engineering Materials, 238-239, 241
Online since April, 2003
Authors Thin-Lin Horng
Keywords Deformation, Material Removal Rate (MRR), Non-Uniformity, Polishing Pad
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