Paper Title:
An Analysis of the Pad Deformation for Improved Planarization
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 238-239)
Edited by
Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima
Pages
241-246
DOI
10.4028/www.scientific.net/KEM.238-239.241
Citation
T.-L. Horng, "An Analysis of the Pad Deformation for Improved Planarization", Key Engineering Materials, Vols. 238-239, pp. 241-246, 2003
Online since
April 2003
Authors
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: T. Je, J. Lee, Doo Sun Choi, E. Lee, B. Shin, K. Whang
453
Authors: Shu Huang, Jian Zhong Zhou, Yi Bin Chen, C.D. Wang, X.D. Yang, Y.C. Dai
Abstract:An appropriate finite element analytical model for laser compound forming (LCF) was established with ABAQUS code, and then some key technical...
3857
Authors: Wei Shin Lin, Bean Yin Lee, Yuan Chuan Hsu, Jui Chang Lin
Chapter 3: Materials Forming, Machining and Joining
Abstract:In multi-wire flat rolling process, the error of the rolled wires in thickness was due to the roller deflection and the spring back of the...
1251
Authors: Anita Avišāne, Janis Rudzitis, Gunārs Upītis, Janis Vilcāns
V. Measurement Techniques
Abstract:The common measurement error when measuring the component geometrical dimensions using universal contact measurement instruments is caused by...
321
Authors: Chuan Shih Wu, Tsair Rong Chen, Sheng Yao Lin
Chapter 5: Mechanical Engineering, Measurement, Control and Automatisation
Abstract:With the gradual rise inthe proportion of the aging population, the world has entered the agingsociety. Thus, the assessments of service to...
963