Paper Title:
Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers
  Abstract

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Periodical
Key Engineering Materials (Volumes 238-239)
Edited by
Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima
Pages
253-256
DOI
10.4028/www.scientific.net/KEM.238-239.253
Citation
N. Yasunaga, S. Okada, "Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers", Key Engineering Materials, Vols. 238-239, pp. 253-256, 2003
Online since
April 2003
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$32.00
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