High-Precision Low-Damage Grinding of Polycrystalline SiC |
| Journal |
Key Engineering Materials (Volumes 238 - 239) |
| Volume |
Advances in Abrasive Technology V |
| Edited by |
Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima |
| Pages |
59-64 |
| DOI |
10.4028/www.scientific.net/KEM.238-239.59 |
| Citation |
L. Yin et al., 2003, Key Engineering Materials, 238-239, 59 |
| Online since |
April, 2003 |
| Authors |
L. Yin, E.Y.J. Vancoille, L.C. Lee, Y.C. Liu, H. Huang, K. Ramesh |
| Keywords |
Diamond Tool, Ductile Grinding, Low-Damage, Polycrystalline SiC |
| Full Paper |
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