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Advances in Abrasive Technology V

Key Engineering Materials Volumes 238 - 239

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• p175 Evaluation of Surfaces of Single SiC Crystal Polished with Various Kinds of Particles   [ 168 K ]
  Authors: Junji Watanabe, Makoto Fujimoto, Yasumichi Matsumoto, Noritaka Kuroda, Osamu Eryu
• p183 Grinding Performance Improvement by a Special Coolant Superimposed with Megasonic Vibration   [ 986 K ]
  Authors: Kiyoshi Suzuki, Hu Bin Qun, Shoji Mishiro, Katsutoshi Tanaka, Tomoyasu Imai, Anurag Sharma, Tetsutaro Uematsu, Manabu Iwai
• p189 Effects of Megasonic Coolant on Cylindrical Grinding Performance   [ 2 M ]
  Authors: Haruhisa Sakamoto, Shinji Shimizu, Kiyoshi Suzuki, Tetsutaro Uematsu, Atsuo Shimotokube
• p195 Effects of the Supplied Cold-Air Condition on Grinding Temperature in Cold-Air Jet Grinding   [ 82 K ]
  Authors: Shigetoshi Ohmori, Masayoshi Tateno, Kunio Kokubo
• p199 An Improved Technique to Determine Coolant Flow Patterns for In-Process Measurement   [ 178 K ]
  Authors: S. Tse, Y. Gao, Y. Kuen, Z. Tao
• p205 Behavior of the Coolant in Grinding with a Floating Nozzle   [ 131 K ]
  Authors: Shinichi Ninomiya, Shin-Ichi Tooe, Kiyoshi Suzuki, Tetsutaro Uematsu
• p213 Application of an Oscillating Spindle to Machining Processes   [ 445 K ]
  Authors: Hwa Soo Lee, S. Sasaki, T. Yamada, K. Mizukawa, Y. Ono
• p219 Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile   [ 59 K ]
  Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
• p223 Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization   [ 310 K ]
  Authors: Jum Yong Park, Dae Hong Eom, Sang Ho Lee, Beom-Young Myung, Sang Ick Lee, Jin Goo Park
• p229 Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results   [ 140 K ]
  Authors: Hyoung Jae Kim, Ho Youn Kim, Hae Do Jeong, Sung Hoon Lee, David Dornfeld
• p235 Material Removal Mechanism in Dynamic Friction Polishing of Diamond   [ 644 K ]
  Authors: Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Nobuo Yasunaga
• p241 An Analysis of the Pad Deformation for Improved Planarization   [ 99 K ]
  Authors: Thin-Lin Horng
• p247 A Study of Nano-Polishing of Injection Molds Using a Fixed Abrasive Pad   [ 1 M ]
  Authors: Jae Young Choi, Ho Youn Kim, Jae Hong Park, Hae Do Jeong, Heonduc Seo
• p253 Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers   [ 1 M ]
  Authors: Nobuo Yasunaga, Shojiro Okada
• p257 Development of a Polishing Disc Containing Granulated Fine Abrasives   [ 537 K ]
  Authors: Hiroki Nakamura, Ji Wang Yan, Katsuo Syoji, Y. Wakamatsu