Advances in Abrasive Technology V
Key Engineering Materials Volumes 238 - 239
doi:10.4028/www.scientific.net/KEM.238-239
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p175
Evaluation of Surfaces of Single SiC Crystal Polished with Various Kinds of Particles
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168 K
]
Authors: Junji Watanabe, Makoto Fujimoto, Yasumichi Matsumoto, Noritaka Kuroda, Osamu Eryu
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p183
Grinding Performance Improvement by a Special Coolant Superimposed with Megasonic Vibration
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986 K
]
Authors: Kiyoshi Suzuki, Hu Bin Qun, Shoji Mishiro, Katsutoshi Tanaka, Tomoyasu Imai, Anurag Sharma, Tetsutaro Uematsu, Manabu Iwai
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p189
Effects of Megasonic Coolant on Cylindrical Grinding Performance
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2 M
]
Authors: Haruhisa Sakamoto, Shinji Shimizu, Kiyoshi Suzuki, Tetsutaro Uematsu, Atsuo Shimotokube
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p195
Effects of the Supplied Cold-Air Condition on Grinding Temperature in Cold-Air Jet Grinding
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82 K
]
Authors: Shigetoshi Ohmori, Masayoshi Tateno, Kunio Kokubo
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p199
An Improved Technique to Determine Coolant Flow Patterns for In-Process Measurement
[
178 K
]
Authors: S. Tse, Y. Gao, Y. Kuen, Z. Tao
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p205
Behavior of the Coolant in Grinding with a Floating Nozzle
[
131 K
]
Authors: Shinichi Ninomiya, Shin-Ichi Tooe, Kiyoshi Suzuki, Tetsutaro Uematsu
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p213
Application of an Oscillating Spindle to Machining Processes
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445 K
]
Authors: Hwa Soo Lee, S. Sasaki, T. Yamada, K. Mizukawa, Y. Ono
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p219
Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile
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59 K
]
Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
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p223
Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization
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310 K
]
Authors: Jum Yong Park, Dae Hong Eom, Sang Ho Lee, Beom-Young Myung, Sang Ick Lee, Jin Goo Park
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p229
Kinematic Analysis of Chemical Mechanical Polishing and its Effect on Polishing Results
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140 K
]
Authors: Hyoung Jae Kim, Ho Youn Kim, Hae Do Jeong, Sung Hoon Lee, David Dornfeld
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p235
Material Removal Mechanism in Dynamic Friction Polishing of Diamond
[
644 K
]
Authors: Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Nobuo Yasunaga
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p241
An Analysis of the Pad Deformation for Improved Planarization
[
99 K
]
Authors: Thin-Lin Horng
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p247
A Study of Nano-Polishing of Injection Molds Using a Fixed Abrasive Pad
[
1 M
]
Authors: Jae Young Choi, Ho Youn Kim, Jae Hong Park, Hae Do Jeong, Heonduc Seo
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p253
Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers
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1 M
]
Authors: Nobuo Yasunaga, Shojiro Okada
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p257
Development of a Polishing Disc Containing Granulated Fine Abrasives
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537 K
]
Authors: Hiroki Nakamura, Ji Wang Yan, Katsuo Syoji, Y. Wakamatsu