Paper Title:
Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress
  Abstract

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Periodical
Key Engineering Materials (Volumes 243-244)
Edited by
Mamtimin Geni and Masanori Kikuchi
Pages
393-398
DOI
10.4028/www.scientific.net/KEM.243-244.393
Citation
K. Machida, M. Gheni, H. Okamura, "Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress", Key Engineering Materials, Vols. 243-244, pp. 393-398, 2003
Online since
July 2003
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