Paper Title:
Effect of Bonding Condition on Microstructure and Properties of the Si3N4/Si3N4 Joint Brazed Using Cu-Zn-Ti Filler Alloy
  Abstract

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Periodical
Edited by
Lianmeng Zhang, Jingkun Guo and Wei-Hsing Tuan
Pages
255-260
DOI
10.4028/www.scientific.net/KEM.249.255
Citation
J. Zhang, H. Y. Fang, Y. Zhou, M. Naka, "Effect of Bonding Condition on Microstructure and Properties of the Si3N4/Si3N4 Joint Brazed Using Cu-Zn-Ti Filler Alloy ", Key Engineering Materials, Vol. 249, pp. 255-260, 2003
Online since
September 2003
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