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Advances in Abrasive Technology VI

Volumes 257 - 258
doi: 10.4028/www.scientific.net/KEM.257-258
Paper Titles published in this Main Theme:
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Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates

Authors: Ji Wang Yan, Takeo Sasaki, Junichi Tamaki, Akihiko Kubo, T. Sugino

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A Controlled Atmosphere Cutting Apparatus for Understanding Tribological Behavior of Lubricants in Near-Dry Machining

Authors: K. Hayashi, I. Inasaki, Toshiaki Wakabayashi, Satoshi Suda, Shinya Suzuki, H. Yokota, Tomohiro Aoyama, M. Nakamura

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Brittle-Ductile Transition in Nano Bending of Monocrystalline Silicon Carbide Analyzed by Molecular Dynamics Simulation

Authors: Hiroaki Tanaka, M. Sano, Shiro Shimada

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Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting

Authors: Jun Shimizu, H. Tanaka, Lian Zhou, Hiroshi Eda

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Abrasive Nanometric Machining: Modelling, Simulation and its Application Promise

Authors: X.C. Luo, K. Cheng

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A Study of the Molecular Dynamics Simulation in Nanometric Grinding

Authors: Ren Ke Kang, X.G. Guo, Dong Ming Guo, Zhu Ji Jin

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Measurement and Analysis of AFM-Based Nano-Indentation on Micro-Machined Silicon Surface

Authors: Qing Liang Zhao, Ming Jun Chen, Ying Chun Liang, Shen Dong, K. Cheng

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A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes

Authors: D. Huo, K. Cheng, D. Webb, F. Wardle

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Influence of the Static Stiffness of Grinding System on the Generation of Affected Layers

Authors: S. Yokoyama, Hwa Soo Lee, T. Yamada

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Geometric Models of the Ultra-Precision Grinding for Large Non-Axisymmetric Optical Aspheric Surfaces

Authors: Cheng Shun Han, Shen Dong, Y.Y. Tang

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