Paper Title:
Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
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Periodical
Key Engineering Materials (Volumes 257-258)
Edited by
Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa
Pages
389-394
DOI
10.4028/www.scientific.net/KEM.257-258.389
Citation
D. H. Eom, J.S. Ryu, J. G. Park, J.J. Myung, K. S. Kim, "Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance", Key Engineering Materials, Vols. 257-258, pp. 389-394, 2004
Online since
February 2004
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