Paper Title:
Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing
  Abstract

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Periodical
Key Engineering Materials (Volumes 257-258)
Edited by
Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa
Pages
407-412
DOI
10.4028/www.scientific.net/KEM.257-258.407
Citation
J. Watanabe, T. Hisamatsu, M. Hirano, "Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing", Key Engineering Materials, Vols. 257-258, pp. 407-412, 2004
Online since
February 2004
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Price
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