Paper Title:
A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
  Abstract

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Periodical
Key Engineering Materials (Volumes 257-258)
Edited by
Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa
Pages
413-416
DOI
10.4028/www.scientific.net/KEM.257-258.413
Citation
J. Y. Choi, H. Kim, J. Park, S. Chung, H. D. Jeong, M. Kinoshita, "A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method", Key Engineering Materials, Vols. 257-258, pp. 413-416, 2004
Online since
February 2004
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