Paper Title:
A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
  Abstract

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Periodical
Key Engineering Materials (Volumes 257-258)
Edited by
Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa
Pages
433-440
DOI
10.4028/www.scientific.net/KEM.257-258.433
Citation
D.H. Lee, D.J. Kwon, Y. K. Hong, J. G. Park, "A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process", Key Engineering Materials, Vols. 257-258, pp. 433-440, 2004
Online since
February 2004
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Price
$32.00
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