Paper Title:
A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 257-258)
Edited by
Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa
Pages
459-464
DOI
10.4028/www.scientific.net/KEM.257-258.459
Citation
J.M. Park, H. D. Jeong, "A Study on the Micro Machining of Si Wafer Using Surface Chemical Reaction", Key Engineering Materials, Vols. 257-258, pp. 459-464, 2004
Online since
February 2004
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Price
$32.00
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