Paper Title:
Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure
  Abstract

The dynamic anti-plane crack problem in a functionally graded smart structure is considered. Integral transforms are employed to reduce the problem to the solution of singular integral equations. Numerical results are presented to show the nfluences of electrical crack condition, crack position, electromechanical combination factor and material gradient parameter on the fracture behavior.

  Info
Periodical
Key Engineering Materials (Volumes 261-263)
Edited by
Kikuo Kishimoto, Masanori Kikuchi, Tetsuo Shoji and Masumi Saka
Pages
257-262
DOI
10.4028/www.scientific.net/KEM.261-263.257
Citation
Z.Z. Zou, J. Chen, S. X. Wu, "Transient Anti-Plane Crack Problem in a Functionally Graded Smart Structure", Key Engineering Materials, Vols. 261-263, pp. 257-262, 2004
Online since
April 2004
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