Paper Title:
Anti-Plane Interface Edge Crack between Two Dissimilar Piezoelectric Blocks
| Periodical | Key Engineering Materials (Volumes 261 - 263) |
|---|---|
| Main Theme | Advances in Fracture and Failure Prevention |
| Edited by | Kikuo Kishimoto, Masanori Kikuchi, Tetsuo Shoji and Masumi Saka |
| Pages | 471-476 |
| DOI | 10.4028/www.scientific.net/KEM.261-263.471 |
| Citation | Shu Hong Liu et al., 2004, Key Engineering Materials, 261-263, 471 |
| Online since | April, 2004 |
| Authors | Shu Hong Liu, Z.Z. Zou, B.Q. Xu, Z.G. Zhang |
| Keywords | Boundary Collocation Method, Intensity Factor, Interfacial Crack, Piezoelectric Material |
| Price | US$ 28,- |
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Abstract
The problem of an interface edge crack between two dissimilar piezoelectric materials is analyzed under the conditions of anti-plane shear and in-plane electrical loading. The crack is considered to be traction-free, but electric permeable one across which the normal component of the electric displacement are continuous. A series form of electromechanical solution and field intensity factors are obtained. The results show that all fields including strain, stress, electric field strength and electric displacement are singular in the front of crack tip. At last, the stress intensity factor is solved by the boundary collocation method (BCM), numerical results are given and discussed.
