Paper Title:
Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films
  Abstract

The volume-averaged hydrostatic parts of thermo-mechanical stresses in the metal interconnect line determined by XRD method and finite element method are compared with each other. Two typical shapes of passivated Al-0.5%Cu thin film with SiN or FOx(Flowable Oxide) are selected for this study. For the numerical calculation, the stress concentration effect around the edge of Al-Cu thin film and elastic-plastic behavior of the film following its hardening rule are considered. For the stress obtained by XRD, the experimental results of Park and Jeon[Microelectron. Eng., 69 (2003) p.26] are introduced. A good agreement is found between the volume-averaged hydrostatic stresses obtained from each method.

  Info
Periodical
Key Engineering Materials (Volumes 261-263)
Edited by
Kikuo Kishimoto, Masanori Kikuchi, Tetsuo Shoji and Masumi Saka
Pages
507-512
DOI
10.4028/www.scientific.net/KEM.261-263.507
Citation
I. Jeon, Y. B. Park, H. Inoue, K. Kishimoto, "Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films", Key Engineering Materials, Vols. 261-263, pp. 507-512, 2004
Online since
April 2004
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Price
$32.00
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