Paper Title:
Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder
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Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
1189-1195
DOI
10.4028/www.scientific.net/KEM.270-273.1189
Citation
Z. M. Jin, H. Kato, K. Kageyama, "Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder ", Key Engineering Materials, Vols. 270-273, pp. 1189-1195, 2004
Online since
August 2004
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