Paper Title:
Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints
  Abstract

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Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
1200-1205
DOI
10.4028/www.scientific.net/KEM.270-273.1200
Citation
J. Y. Choi, H. J. Kim, J. K. Lim, Y. W. Mai, "Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints ", Key Engineering Materials, Vols. 270-273, pp. 1200-1205, 2004
Online since
August 2004
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$32.00
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