Paper Title:
Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity
  Abstract

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Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
1761-1766
DOI
10.4028/www.scientific.net/KEM.270-273.1761
Citation
K. Y. Jhang, J. Ha, H. S. Jang, "Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity", Key Engineering Materials, Vols. 270-273, pp. 1761-1766, 2004
Online since
August 2004
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Price
$32.00
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