Paper Title:
Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique
  Abstract

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Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
1833-1838
DOI
10.4028/www.scientific.net/KEM.270-273.1833
Citation
W. Yi, C. S. Jang, J. Y. Han, M. G. Kim, "Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique", Key Engineering Materials, Vols. 270-273, pp. 1833-1838, 2004
Online since
August 2004
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