Paper Title:

Application of Micro-ESPI Technique for Measurement of Micro-Tensile Properties

Periodical Key Engineering Materials (Volumes 270 - 273)
Main Theme Advances in Nondestructive Evaluation
Edited by Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages 744-749
DOI 10.4028/www.scientific.net/KEM.270-273.744
Citation Yong Hak Huh et al., 2004, Key Engineering Materials, 270-273, 744
Online since August, 2004
Authors Yong Hak Huh, Dong Iel Kim, Dong Jin Kim, Philip Park, Chang Doo Kee, Jun Hyub Park
Keywords Copper Foil, Elastic Modulus, Micro-ESPI, Stress-Strain Curve, Tensile Strength, Yielding Strength
Price US$ 28,-
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