Paper Title:
Application of Micro-ESPI Technique for Measurement of Micro-Tensile Properties
| Periodical |
Key Engineering Materials (Volumes 270 - 273)
|
| Main Theme |
Advances in Nondestructive Evaluation
|
| Edited by |
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee |
| Pages |
744-749 |
| DOI |
10.4028/www.scientific.net/KEM.270-273.744 |
| Citation |
Yong Hak Huh et al., 2004, Key Engineering Materials, 270-273, 744 |
| Online since |
August, 2004 |
| Authors |
Yong Hak Huh, Dong Iel Kim, Dong Jin Kim, Philip Park, Chang Doo Kee, Jun Hyub Park |
| Keywords |
Copper Foil, Elastic Modulus, Micro-ESPI, Stress-Strain Curve, Tensile Strength, Yielding Strength |
| Price |
US$ 28,- |