Paper Title:
Reflow Characteristics of Copper in an Oxygen Ambient
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 270-273)
Edited by
Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee
Pages
820-825
DOI
10.4028/www.scientific.net/KEM.270-273.820
Citation
S. H. Kim, D. W. Kim, "Reflow Characteristics of Copper in an Oxygen Ambient", Key Engineering Materials, Vols. 270-273, pp. 820-825, 2004
Online since
August 2004
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Price
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